A New Method Permits Soft Soldering Of Aluminum - Objective

Provide an effective method for "soft" soldering aluminum and aluminum alloys using conventional tin-lead solder alloys and flukes. The Problem In the past, it was virtually impossible to solder aluminum and aluminum alloys using standard tin-lead soldering systems (solder and flux) due to the presence of an aluminum oxide surface film which forms instantly on aluminum and aluminum alloys when these are exposed to air. The tenacious and stable oxide film enables aluminum-base materials to maintain their bright luster. But the film also prevents the required wetting and spreading of solder on the substrate, causing the loss of adhesion between the solder and the substrate. In addition, the heat produced during soldering increases