Application Trends of Gold-Tin Solder Paste for Fine Pitch Devices

In a radio frequency and optoelectoronic device packaging, Gold-Tin (Au-20 wt% Sn eutectic) solder is used widely due to the excellent electrical and thermal conductivity, high strength, and negligible creep characteristic under repetitive thermal cycling. With the recent lead-free movement, Gold-Tin solder is recognized as an alternative material for high temperature Lead-Tin solder. Generally, Gold-Tin solder is supplied in the forms such as ribbons, pellets, and ring frames. However, these forms must be set-up accurately on the joint area to press chips in bonding, therefore, it is difficult for these forms to satisfy the recent requirements for the down sizing in the connection areas. On the other hand, Au-20 wt% Sn solder paste can be applied flexibly to various supplying methods, such as printing, dispensing system and pin transcript. These methods also make it possible to reduce the production cost. However, in the case of using the solder paste, the void issue is one of the most undesirable problems. The void causes the degradation of the characteristics such as the bond strength, electrical characteristic and thermal conductivity. We have been intensifying the development of the void free paste, and have achieved void reduction by optimizing the powder size, the flux composition and the reflow condition.