Copper Recovery From Waste Printed Circuit Board

The leaching of copper from a printed circuit board (PCB) and the electrodeposition of copper from a cuprous solution in ammoniacal alkaline solutions were examined in order to develop an energy-saving hydrometallurgical process for copper recovery from electronic scrap. In the leaching experiments, copper in the PCB was oxidized by Cu(II), and Cu(I)-ammine complex ions were formed. The copper(I)-ammine complex slightly depressed the leaching rate, while Cu(II)?ammine markedly enhanced it. During the electrodeposition experiments, the current efficiency of copper deposition was approximately 100% in the current density range of 200 to 1000 Am-2. The electrodeposition of copper from the Cu(I)-ammine complex solution favored the production of plates rather than powders.