Dynamic Recovery during Low Temperature Deformation in an Al-0.1mg Alloy

The Minerals, Metals and Materials Society
Y. Huang P. B. Prangnell
Organization:
The Minerals, Metals and Materials Society
Pages:
8
File Size:
633 KB
Publication Date:
Jan 1, 2012

Abstract

"An Al-0.1Mg alloy was firstly deformed at room temperature by ECAE to a true strain of 10, where a steady state deformation was established and further processing had little effect on grain refinement. The ECAE samples, with an average grain size of ~0.55µm, were then compressed in a channel die at 77K- 473K to various reductions. Microstructures were characterized by electron backscatter imaging and EBSD in a FEGSEM. Grain refinement to the ECAE submicron structure occurred during deformation at cryogenic temperatures of 77 – 213K, whereas coarsening took place during deformation at elevated temperatures. A steady state deformation was observed at all temperatures where a constant grain structure was developed and maintained upon further straining due to dynamic recovery. The mechanisms of dynamic recovery during steady state deformation at cryogenic temperatures are discussed.IntroductionSevere deformation processing (SDP) has been successfully used to produce submicron grain structures, and in some cases nano-scale crystallite sizes, in a wide range of alloys. However, the rate of grain refinement becomes increasingly inefficient at high strains as a steady state grain structure is approached [1-3]. Steady-state grain sizes have also been reported in other ultra-high strain deformation processes, like cryogenic ball-milling [4]. There is thus a minimum grain size achievable in a material by a given SPD process under constant deformation conditions.It is well documented that a steady state subgrain size is observed in warm deformation of metals due to dynamic recovery (e.g. [5]). In severely deformed alloys a constant grain size at ultra-high strains has similarly been attributed to dynamic recovery [1-3]. Mechanisms have been proposed, for rapid deformation induced grain growth including stress driven boundary migration and breakaway from solute pinning [2]. However, as pointed out by Humphreys et al. [2] the restoration processes are currently poorly understood, particularly at low temperatures, where the boundary migration rates required to maintain a constant grain size are orders of magnitude higher than can be satisfactory explained from diffusion controlled migration. Similar to the subgrain size, the steady state grain size obtained during SDP is generally related to the temperature compensated strain rate [2, 6]. Thermally activated restoration processes are thus expected to be suppressed by lowering the deformation temperature and a smaller steady state grain size can be achieved."
Citation

APA: Y. Huang P. B. Prangnell  (2012)  Dynamic Recovery during Low Temperature Deformation in an Al-0.1mg Alloy

MLA: Y. Huang P. B. Prangnell Dynamic Recovery during Low Temperature Deformation in an Al-0.1mg Alloy. The Minerals, Metals and Materials Society, 2012.

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