Effect of Commercial Electrowinning Additives on the Nucleation and Growth of Copper on Stainless Steel

"Nucleation and growth of copper on 316L stainless steel from synthetic acidified copper sulfate was studied in the absence and presence of chloride ions and/or organic additives (HydroStar® 4208, DXG®-F7, Cyquest® N-900) using a potentiostatic technique. The current-time data obtained at 0.16V vs. SHE was analyzed using nucleation and growth models. Scanning electron microscope (SEM) images of deposits produced at 300 A m-2 show that the addition of 20 mg/L chloride ions increased the size and reduced the number of copper nuclei. Potentiostatic current-time data from the electrolyte without organic additives indicate progressive nucleation with two-dimensional (2-D) growth under diffusion control. SEM images obtained confirmed progressive nucleation with 2-D growth. 20 mg/L Cl- and 2.5 mg/L organic additives did not change the nucleation and growth mechanism, however the additives increased the number and reduced the size of copper nuclei leading to more uniform coverage of the stainless steel substrate.INTRODUCTION Electrowinning of copper is an important process in the manufacture of high purity copper metal. It is approximated that 20% of the world’s refined copper is produced from acidified copper sulfate solutions by electrowinning (Schlesinger, Sole, and Davenport, 2011). In many plants, copper is electrodeposited on AISI 316L stainless steel substrates for a period of 6-7 days, after which the copper is stripped from the blanks. Even though the deposition time for a commercial copper electrowinning circuit is around one week, it is critically important to control the nucleation, growth, and nature of the initial deposit (Sun and O'Keefe, 1992). Deposit morphology and structure are influenced by the real current density at the electrode surface. The real current density across the cathode surface is made uniform by proper design of the electrowinning cell and electrodes and careful operational practice. Even with good design and control, some current maldistribution occurs. The outcome of severe current maldistribution is poor deposits that affect product quality and/or increase energy consumption. To combat current maldistribution and create a larger operating window in terms of current density, temperature, and copper concentration, small amounts of organic smoothing agents (traditionally guar products) are added to copper electrowinning electrolytes. Moreover, these additives inhibit the growth of copper dendrites, which leads to improved deposit quality by producing bright, smooth, and dense cathodes."