Effect of sodium persulphate on blister copper anode passivation, M. Karimi, H. Naderi, M.H. Nikzad, H. Zare, and J. Petersen

In the copper electrorefining process, the dissolution of anodes is significantly reduced or even stopped when the passivation phenomenon occurs. The results of this phenomenon are increasing energy consumption, residual formatting, and voltage levels in the cell. In this study, the electrochemical behaviour of blister copper in the presence of sodium persulfate (PDS) was studied. The electrochemical methods of LPR, Tafel, and Electrochemical Impedance Spectroscopy (EIS) were used. The results showed that the addition of sodium persulfate activates the electrode surface and increases the open circuit potential. In the presence of PDS, the polarisation resistance of the electrode shows an increasing or decreasing tendency, based on the PDS concentration. This tendency is probably due to the formation of surface layers (such as slime layer or copper sulfate) and dissolution of this layer at various concentrations of PDS. The lowest polarisation resistance of 1.8 ohms and the highest corrosion current of 60.6×10-3 and 36.6×10-3 A/cm2 from LPR and Tafel techniques respectively were obtained at the concentration of 40 g/l PDS. Based on the results of potentiodynamic and electrochemical impedance spectroscopy tests, the addition of sodium persulfate to the solution reduces the corrosion resistance, therefore the passivation time of the blister copper anode increases. Keywords: Blister copper, electrorefining, sodium persulfate, anodic passivation