Evaluating the Impact of Mechanical Pre-Treatment on Leaching of Base Metals from Waste Printed Circuit Boards

"Hydrometallurgical processes used for metal recovery from waste printed circuit boards (PCBs) typically involve dismantling, shredding and physical separation prior to successive leaching stages for selective dissolution of different metals. The principles of the physical separation units are well understood, but valuable metal losses of more than 30 % can be incurred during these processing steps. The impact of the physical separation units’ performance on downstream leaching operations have not been defined; this prevents the development of a well-integrated process. The objective of this project was to determine to what extent the base metal leaching behavior depends on the physical separation pre-treatment. PCBs were shredded to 100 % passing 2 mm before physical separation by dense medium separation (DMS) as well as magnetic separation. Batch leaching tests using various concentrations of sulfuric acid were conducted on three feed fractions: (1) shredded PCBs without any physical separation, (2) heavy fraction recovered from DMS, and (3) non-magnetic fraction recovered from the DMS heavy fraction. DMS increased the metal content in the feed from 48 % to 75 % on a mass basis, but 70 % of the gold and 20 % of the copper reported to the light fraction. The application of magnetic separation to the heavy fraction produced by DMS removed 67 % and 61 % of the iron and nickel, respectively, while negligible amounts of non-magnetic metals were removed. Although DMS successfully concentrated the feed and magnetic separation removed the majority of iron and nickel, these steps did not result in any improvement in the rate or extent of copper leaching. Metals generally leached faster when the sulfuric acid concentration was increased from 1 M to 2.5 M; this effect was seen to be more pronounced for pretreated feed. INTRODUCTION The fast rate of technological development has led to a decrease in the service life of electronic devices. This is resulting in an increased rate of electronic waste generation. The recovery of metals from electronic waste is of environmental and economic interest. The majority of these metals are typically located on printed circuit boards (PCBs) within electronic devices (Tuncuk, Stazi et al., 2012). Hydrometallurgical processes are considered a viable option for small scale metal recovery from waste PCBs, and generally involve the following steps: disassembly for removal of hazardous and reusable parts, size reduction, physical separation, successive leaching stages for metal dissolution and finally recovery of metals from leach solutions."