Inductively Coupled Plasma Deposition of Ceramic Films: A Review

The deposition of ceramic materials onto substrates is of special interest in the development of surface related technologies. Research interest has been placed on using thermal plasma as the deposition method, specifically inductively coupled plasmas. Many different modifications to the same basic principle of deposition have been performed through out the materials research community. Such a technique may have many advantages over more conventional techniques, such as high deposition rates, high surface area coverage, clean energy source, no contamination from electrodes and operation near atmospheric pressures. Materials deposited vary from simple oxide systems like TiO2 to more complex structures like ternary oxides and nitrides. This paper reviews recent developments relative to the inductively coupled plasma deposition of thin films.