Investigation on the Thermal Conductivity of Inorganic-Filler/Resin Composite

"In order to obtain basic data for the development of highly thermally conductive composite materials, the thermal conductivity of a resin composite material with an Aluminum Nitride filler was assessed. Several different measurement techniques such as the xenon flash and the temperature wave thermometric analysis method were employed to gather data on these composites. An excellent match between theoretical and experimental data was achieved by employing a predictive expression that takes into account the effect of percolation on thermal conductivity.IntroductionA thermal solution composite is made by incorporating dense inorganic fillers with high thermal conductivity into a resin. Because the composite materials have high thermal conductivities, they have been used in electrical products that generate excessive thermal energy during operation, such as inverters, amplifiers and motor drivers. They function as electrically insulating and thermally conducting parts of the electric modules. As the uses of thermal solutions are expanded, composites of higher thermal conductivities will be required. The aim of this work was to investigate, evaluate, and try to predict the influence of key parameters on thermal conductivity and diffusivity. This was achieved by analyzing the effect of both volume fraction and shape of Aluminum Nitride ceramic fillers and measuring the thermal conductivity. In addition, the influence of percolation on thermal conductivity is considered. The thermal conductivity of the composites is discussed by employing a predictive equation using literature data of thermal conductivities for both the filler and resin. As well as thermal conductivity measurements the effect of volume fraction of the filler was also explored.ExperimentalSpecimen PreparationThe composite samples were prepared from silicone resin and Aluminum Nitride (AlN) fillers. The AlN fillers with an average particle size of 20 µm are shown in Figure 1. The mean diameters of the AlN particles used are given in Table I. For comparison the AlN fillers with an average particle size of 5 µm are shown in Figure 2. A planetary centrifugal mixer was used for simultaneously dispersing the components uniformly and de-aerating the mixture. After mixing, these materials were placed in a silicone rubber case and cured at 150 °C for 1 hour."