Leaching Studies for Metals Recovery from Waste Printed Wiring Boards

- Organization:
- The Minerals, Metals and Materials Society
- Pages:
- 8
- File Size:
- 167 KB
- Publication Date:
- Jan 1, 2012
Abstract
"Leaching process has been suggested to recover most metals from waste PWBs. In this study, the leaching behavior of most metals present in waste PWBs is evaluated before and thermal treatment. Different leaching acids: hydrochloric acid (HCl), nitric acid (HNO3) and aqua regia are compared. The effects of acid concentration, particle size of sample, leaching time and temperature are examined. Results revealed that most metals are present in small particle size and sequential leaching of PWBs with a combination of HCl acid and aqua regia is capable of dissolving most of the metals content of PWBs. Leaching of thermally treated PWBs produced the highest leaching percentages for similar leaching conditions.IntroductionApproximately 20–50 million tonnes of electronic waste (e-waste) is produced globally per year. Waste Electrical and Electronic Equipment (WEEE) or E-waste is one of the fastest growing waste streams in the world. In developed countries, it equals 1% of total solid waste on an average [1]. The growing stockpile of used and obsolete consumer electronics has been called the “largest toxic waste problem of the 21st century [2]. Printed wiring boards (PWBs) is an essential part of almost all WEEE, and accounts approximately 3% of all WEEE by weight [3]. PWBs are a platform upon which microelectronic components are mounted. PWBs contain metals (~40 wt. %), ceramics (~30 wt. %) and plastics (~30 wt. %) [4]. The metallic part includes; Cu, Pb, Zn, Fe, Cd, Be, Cr, Au, Pt, Pd, Ag, etc. The plastic part of the PWBs is mostly epoxy resins. These plastic resins also contain very toxic halogenated flame retardants (HFRs) [5]."
Citation
APA:
(2012) Leaching Studies for Metals Recovery from Waste Printed Wiring BoardsMLA: Leaching Studies for Metals Recovery from Waste Printed Wiring Boards. The Minerals, Metals and Materials Society, 2012.