Mechanical Recycling of Electronic Wastes for Materials Recovery

In this paper, the mechanical milling of the Printed Circuit Boards (PCB) was carried out. First goal of the work was to examine the management of the WEEE, in particular the re-use of PCB. Firstly, recycling methods of PCBs were summarized. During the study mechanical separation methods (magnetic-, density- and air separaten), electrical, and chemical methods were examined. Secondly the optimal particle size for air-classification was determined. Several tests were carried out to find the most effective separation method for separation of different material groups from PCB scrap. The new air classification stand was developed for testing the separation of lightweight particles like tinfoil stripes and plastics. The test results showed sufficiently good separation of heavier Al and Cu. For milled materials characterization the SA, IA, laser diffraction analysis and SEM were used. The chemical composition of the PCB powders was studied by means of energy dispersive X-ray microanalysis (EDS).