Nucleation And Initial Stages Of Growth Of Copper Electrodeposited On Anodized 304 Stainless Steel

Stainless steel is increasingly used as a cathode starting sheet. It was shown earlier that even when depositing copper on copper, a substrate-influenced zone appears in the deposit structure, followed by a transition zone and finally by the electrolysis-influenced structure. On copper, the substrate-influenced zone has a thickness of twenty micrometers and on titanium, eventually more than fifty micrometers. Initial nucleation and growth have a considerable influence. In this paper, copper was deposited in a channel cell on four different 304 stainless steel substrates: mechanically polished and anodized, respectively, at 0, +400 and +800 mV/SHE in 1M H2SO4 at 20°C. Copper was deposited under electrowinning conditions after solvent extraction (SX) (40 g/l Cu++, 180 gh/l, H2SO4, 20 or 60°C). The results showed that, although Auger surface analyses of the substrates were only slightly different one from another including the oxide thickness, nucleation and initial stages of growth were very sensitive to the surface treatment of the substrate. Potential step and current step methods gave similar results : progressive nucleation followed by 3D diffusion controlled growth. The highest nucleation frequency was observed on stainless steel anodized at 0 mV/SHE, under various electrolysis conditions. The potential influence of these findings on industrial practice is discussed.