Prediction of Lateral and Normal Force-Displacement Curves for Flip-chip Solder Joints

"We present the results of experiments and modeling of flip-chip geometry solder joint shapes under shear loading. Modeling, using Surface Evolver, included development of techniques that use an applied vector force (normal and shear loading) as input to determine a vector displacement of the pads connected by the solder joint (standoff height and misalignment). Previous solutions solved the converse problem: fixed displacements used to determine required applied force. Such solutions were inconvenient for applications, where the applied force (chip weight) is known. Also, for geometric and materials studies of solder joint shapes involving multiple parameters, determining the equilibrium displacement from applied force by bracketing solutions could become computationally expensive. Measurements of solder joint standoff height and misalignment as functions of the applied force (normal and shear), solder volume and pad diameter are presented. Experiments were carried out for solder ball diameters from 0.38 mm (0.029 mm3 volume) to 0.15 mm (0.0019 mm3 volume) on pads of diameter 0.64 mm and 0.35 mm. Fitting of simulation to experimental results gave optimized values for the contact angle and surface tension of the solder which were consistent with measured and literature values. IntroductionIn packaging technology flip-chip has become an important method for attaching semiconductor devices to substrates. Generally, the chip and substrate are bumped with solder and then the chip is flipped onto the substrate and the solder reflowed to form conductive interconnects. An epoxy underfill is normally flowed between the substrate and chip to reduce the thermal fatigue on the solder joints. A flip-chip assembly is illustrated in Figure 1.In flip-chip applications, the use of an integrated underfill/solder bump system [1, 2) removes an extra process step, namely infiltration of the underfill. However, the presence of an underfill will retard the self-alignment of the flip-chip. A first step in understanding and predicting this retardation is to develop a model to describe normal and lateral force-displacements curves when underfill material is not present. At this stage it is unclear whether static surface tension theory is sufficient to describe a complete model for flip-chip realignment even without underfill."