Rate Of Metal Deposition From Aqueous Solutions

The electrodeposition of metal ions from aqueous electrolyte solutions has been a well-known process for the last half century. With numerous industrial applications such as electroplating, electrowinning and electrorefining, the kinetics of electrochemical reactions involved in the process has been extensively researched. Arrhenius-type rate equations, the Butler-Volmer equation, and the empirical Tafel equation are among the most important models to explain the rate of electrochemical reactions. The study of the kinetics of metal deposition is critical to understanding the underlying mechanisms through which a certain morphology of metal deposit is formed on the cathode. The purpose of this paper is to elucidate the influence of experimental parameters such as pH and additives on the rate and the reaction mechanism determining the rate limiting step of the electrodeposition reactions.