Reaction Of Sn-Containing Solders With Nickel Based Under Bump Metallizations

This work relates to wafer bumping technologies for flip chip packaging applications in the electronics industry. Nickel and its alloys are alternative under bump metallization (UBM) materials because of their slower reaction rates with Sn-based solder as compared to Cu-based UBMs. In this study, we compared the morphologies of the intermetallic compounds (IMC) formed between Sn-bearing solders (Sn3.5Ag and eutectic Sn-Pb) and two types of nickel- based UBMs, electroless Ni-P (EN) and sputtered nickel. Both chunky-type and needle-type of intermetallics were observed between the EN UBM and the solders. In the case of sputtered Ni UBM, there is only a layer of scallop-type intermetallics formed. The morphology change and growth kinetics of the IMC in thermal aging process were analysed. Kirkendall voids were noticed from samples of Sn3.5Ag solder vs Ni-P UBM that have undergone prolonged thermal aging at high temperature.