Recovery of Copper and 1, Hydroxyethane-1, 1-Diphosphonic Acid (Hedp) From Cyanide-Free Electroplating Wastewater by Electrodialysis

"In copper plating processes, a fraction of raw materials are incorporated to the final products, while other portions are discarded as effluents. In this study, the application of electrodialysis (a membrane treatment process) was studied for treatment of wastewaters from cyanide-free strike baths, in order to reuse the components of this bath: copper and HEDP. The synthetic solutions studied consider 1 % of ion concentration of the bath used in this process, simulating the rinsing waters to be discarded. The electrodialysis allowed a percentage extraction up to 73% of copper ions and 72% of HEDP from the effluent. Complexes formation between the acid and copper indicates the possibility of recovery of components in the same compartment, obtaining a concentrated solution of these substances that can be reinserted in the process, for compensating drag-out losses. A diluted solution is also obtained, that can be reused as water in rinsing tanks.IntroductionIn metal finishing industries, contaminants in wastewater and the type of treatment required are determined according to the type of operation [l]. Generally, electroplating industries employ conventional wastewater treatments, e.g. oxidation of cyanide and chemical precipitation. This stage promotes reactions with soluble compounds to produce an insoluble precipitate, removed by physical separation. The sludge is dried by press-type filters [2].In this manufacturing sector, part of the raw materials are discarded as hazardous waste. The cost of discarded compounds and the treatment and disposal of waste may compromise profit margins. In addition, water consumption per unit of production stimulates the development of methods able to recover and reuse the largest possible amount of water [3].In some plating processes, cyanide-based substances are used as complexing agents and as raw materials in form of metal salts [4]. However, the toxicity associated with cyanide has been promoting research for the development of new raw materials in plating processes.A study conducted in Brazil [4] evaluated the modification of a commercial cyanide-free bath for processes of copper coating on Zamak. In the performed study, a new alkaline copper bath was formulated using l,hydroxyethane-1,1-diphosphonic acid (HEDP), an organic compound known for forming stable complexes with metal ions.As results of the study, the operational conditions and the formulation of a bath to obtain adherent, uniform and bright layers were established (Table I) [4]."