Research on Inclusions in CUCR Alloy Prepared by Thermit Reduction

"CuCr alloy can be extensively used as contact materials in integrated circuit, electrodes, electric contact and high strength conductor. We proposed thermit reduction-electroslag remelting method of preparing the large scale CuCr alloy. But there are pores and oxide inclusions in CuCr alloy prepared by thermit reduction process. This paper studied mainly the effects of ratio of reactant and additive on the inclusion type and their occurrences in CuCr alloy. The slags and CuCr alloy were characterized respectively by XRD and SEM. The results show that when the additive is Na3AlF6, the slag consist of Al2O3 and Cr. When the additive is CaF2, the slag consist of Al2O3, Cr, CaF2 and CaAl4O7. The inclusions in CuCr alloy are mainly Al2O3 and pores which disperse in Cu-rich zone and Cu-Cr phase interface. When 5% CaF2 and 5% KClO3 are added, there are fewer pores and inclusions, and the more better microstructure.1 IntroduceCuCr alloy is the contact terminal material with an eximious properties[1,2], which gradually replaces CuBi alloy becoming the first choice for contact terminal material in the medium and high power vacuum switch after the 1970s. The traditional preparation methods of CuCr alloy mainly contain powder metallurgy, infiltration process and vacuum electric arc melting methods. But the above methods exist some shortcomings, such as poor product quality, high cost of production, processes complex ect[3-9]. CuCr alloy is made by the thermit reduction self-propagating method, which uses CuO, Cr2O3 and Al as raw material to get the high-temperature melt, and then casts to manufacture CuCr alloy ingot, which response equation follows as:"