Study on Thermal Stabilities of 2- substituted Benzimidazoles Copper and Zinc Complex

"2-substituted benzimidazole-zinc and 2-substituted benzimidazole-copper complexes were main components of organic solderability preservative (OSP) in PCB producing process and affect the thermal stability of OSP film. So these four complexes were prepared by 2-substitutedbenzimidazole reacting with zinc ion and copper ion, the complexes crystals were determined by IR, its thermal stabilities were studied by TG method. The results indicated that the thermal stability of 2-substituted benzimidazole-zinc is higher than the 2-substituted benzimidazole copper,and the thermal decomposition mechanism was presentedIntroductionImidazole compounds which is an important heterocyclic compound shows the important value and outstanding prospects[I-3l in field of biological engineering, medicine, and high-performance composites. It's said that imidazole compounds is an excellent new metal surface treatment[4] agent, because it has good reaction activity with metals and can form a chemical layer on the metal surface. The complexes of imidazole were main components of organic solderability preservative (OSP) in PCB producing process and affect the thermal stability of OSP film. The mechanism of imodazole combined with metal and film deposited has been reported, but the opinions about thermal stability of film have bifurcation, let alone the thermal decomposition mechanism of film at high temperature. The complexes were prepared by combining of 2- substituted-benzimidazole with zinc and copper iron, which were studied by IR and TG method, in order to get thermal stability of different complexes."