Symposia - Symposium on Creep of Nonferrous Metals and Alloys - Creep Characteristics of a Phosphorized Copper

The state of knowledge bearing on the stability of copper under stress at elevated temperatures is generally known to be in need of revision and extension. The present investigation, dealing with the creep characteristics of a deoxidized copper of low residual phosphorus content, is intended to contribute in some small measure toward this end. The experimental data presented herein have been correlated by methods of evaluation and interpretation familiar to those who are concerned with crecp of metals. In practice it is common, if not requisite, to use structurally stable materials at elevated temperatures. It is frequently desirable, however, to test materials under conditions that produce structural change, in order to determine the extent of such change and its effect on physical properties, thus making it possible to establish accurately the limiting conditions to which such materials may be safely exposed. The creep characteristics of the drawn copper wire of this investigation arc directly associated with its structural instability at elevated temperatures. Complete realization of this fact is essential to the evaluation of its creep resistance under various conditions. Creep results should apply to steady deformation under equilibrium conditions, but these are seldom attained in only one or two thousand hours. It will be shown that steady creep rate for copper at useful stresses does not usually begin until considerably more time has elapsed. A wholly satisfactory substitute or shortcut for extensive creep testing does not appear to be evident in the application of mathematical analyses to limited experimental data. Material A single lot of phosphorized copper wire was drawn down to 0.125-i11. diameter with a final reduction of 84 per cent. After mechanical straightening, a portion of this wire was annealed to an average grain size of 0.013 mm. in a controlled-atmosphere furnace. The composition and initial properties of the copper in these two conditions are listed in Table I. Photomicrographs of the original structure are shown in Fig. I.