The Action Of Reducing Gases On Hot Solid Copper -Discussion (73d8374b-ec51-4f5e-b6b8-39e2e050a520)

NORMAN B. PILLING (author's reply to discussion *).-The discussion by Mr, Bassett raised one or two points that deserve further discussion. The printed figure for the lead content of the copper used was 0.015 per cent. and not 0.15 per cent., upon which his comment was based. A copper having the latter figure would, of course, be quite unusual. Mr. Bassett takes exception to the writer's statement regarding the distribution of cuprous oxide in wrought copper and states that "the FIG. 1.--ROLLED AND ANNEALED SHEET. ETCHED WITH AMMONIA AND HYDROGEN PEROXIDE. X 75. eutectic of copper with cuprous oxide is usually found between the crystals of pure copper, whether in the cast or the wrought form." While it is very well known that during the solidification of cast copper the cuprous oxide is segregated completely as an envelope of cuprous oxide-copper eutectic around the crystals of copper free from oxide, it is the writer's opinion that, as a result of repeated rolling, this eutectic structure is quite destroyed and the small particles of cuprous oxide become widely scattered, and in the recrystallization following, during annealing, the rearrangement of the grain boundaries takes place with much indifference to the actual distribution of these particles. In the accompanying micrograph, taken from a rolled and annealed sheet, the random distribution of the small cuprous-oxide particles with reference to the location of the grain boundaries may be seen.