The Effect Of Plating Additives On The Recovery Of Copper From Dilute Aqueous Solutions Using The Chelating Resin Dowex M4195

Copper is rapidly being adopted by the semiconductor industry as the interconnect material of choice. The aqueous processing techniques used generate wastes such as spent electrolyte from electroplating, electroplating rinse water, copper solutions from removing copper from the back of the wafer and CMP waste streams. We are examining the use of chelating resins as a means of recovering copper from these streams within the processing plant, thereby allowing recycling of process water and minimizing hazardous waste disposal costs. We have examined the effect of model plating additives (and other organic complexing agents) on the efficacy of Dowex M4195. Although these might have had a significant effect, commonly used electroplating additives polyethylene glycol (PEG), benzotriazole (BTA), thiourea, glycine, and 3-mercapto-1-propanesulfonate (MPSA) each had little or no effect on the ability of the resin to chelate copper and remove it from solution. This suggests that Dowex M4195 could be useful for treating waste solutions of rather variable compositions.