The Removal Of Ni From Ni Plated IC Leadframe Scraps

It is invariably certain that after punching for IC Leadframes, scrap metal were generated. These seraps were re-dissolved and in order to use as raw material for leadframes, it is necessary to remove the Ni plating. In this study a simple method was developed for the removal of Ni plating by surface oxidation of Ni plating. For this purpose a fundamental study was carried out on the oxidation behavior of Ni plating. Results showed that by controlling the oxidation condition, a considerably high rate of Ni could be removed.