Wettability of Tin-Bismuth-Silver Solder

"The development of lead-free solders is urgent in view of environmental standpoints. In this -work the wettability of tin-bismuth- silver solders on copper was studied. Three kinds of fluxes were used. The wettability of conventional eutectic tin-lead .solder exhibited an excellent level over the other solders of tin-bismuth systems. Poor wettability of the tin-bismuth solders may be caused by the growth or dendritic copper-tin compounds at copper/solder interface, in contrast to the case of tin-lead'· solder. The wettability was improved by the addition· of silver in the solder. In this tin bismuth- silver system, silver was abnormally concentrated at the copper I solder interface even in the initial stage of contact. The wettability of the solder and the thickness of compound formed on the copper have a good correlation; the solder containing 2% silver exhibited the best wettability and the formation rate of copper-tin· compound on the copper was slowest.IntroductionSocial demand to avoid lead use in the industrial fields has been recently promoted· (1) because of the environmental protection of water resources. Especially the lead-bearing solders have been widely used in electronics and automobile products, and it is urgent to replace them with nontoxic materials (2)-(4). Thus the development of lead-free solders becomes an indispensable subject to the new generations and many works (5)(6) have already been carried out on the research and development of new solders. New lead-free solders are expected to have some requirements, for example, moderate melting temperature, proper strength and integrity, and lower prices, as compared with conventional solders. There have been already several alloy systems developed. Among ·these alloy systems, tin-bismuth binary or tin-bismuth-silver ternary alloys have great advantages such as having a wide range of soldering .temperature by controlling con:ipositions, though they have such disadvantages as ""lift-off"" (7)-(9): It is said, on the other hand, that a frequently overlooked property of solders, or one that is typically ignored by the research scientist as an ""issue"" for the manufacturing or product engineer, is wettability (10), although a ·work on the wettability has recently been published (11). In this Work, therefore, the authors selected Sn-Bi-Ag solders and focused mi the effect of Ag-addition to wettability of the solder."